Water-based adhesion promoter HY-200MP

Product introduction:

HY- 200MP is a functional adhesion enhancer for aqueous system. Used to enhance the adhesion of most common emulsions and substrates such as waterborne epoxy resin, waterborne acrylic resin and waterborne polyurethane. Such as metal, glass, ceramics, concrete and other inorganic substrates.

Product features:

HY-200MP has strong molecular activity. It can form covalent bonds with strong binding force with emulsion and inorganic substrate, which makes the binder and substrate have strong binding force and difficult to peel off..

Practical application shows that HY-200MP in acidic conditions (PH=4 or so), the adhesion strengthening effect is more obvious. HY-200MP can exist stably in water, and long-term storage does not affect the performance.

Typical materialized data:

Suggestions for use:

Dosage: HY-200MP is generally recommended to add 0.3%-1% of the solid content of the formula (emulsion resin solid content + pigment + filler). The specific amount of addition should be adjusted according to the actual formula, the amount of addition is too small, the formula can not achieve the ideal adhesion increase effect, the amount of addition is too large, but it will have a negative effect.

Note: Add HY-200MP directly to the formula, mix well, and leave for 2-3 days before subsequent application.

Packing, storage and transportation:

25kg/barrel, this product is transported as non-dangerous goods, transportation storage temperature -5°C~40°C, to avoid contact with acid.

Additional Disclaimer: This information is based on the information and experience currently available to us. It only describes the performance of our products, but does not guarantee the performance of the products in a legal sense. It is recommended to test our products first to determine if they can achieve the desired results.